Support
Failure Analysis
Return a failed module and our lab will isolate the root cause — silicon, PCB, component or system level.
FA workflow
From symptom to root cause
01
RMA intake
Submit S/N, symptom and platform.
02
Non-destructive
Electrical test, visual, X-ray.
03
Destructive
Decap, probe, material analysis.
04
8D report
Root cause + corrective action.
Typical findings
What we look for
- ✓Cell / through-silicon via defects
- ✓Solder joint & BGA open/crack
- ✓Contamination & ESD damage
- ✓SPD / firmware mismatch
- ✓System-level training issues
Suspect a defective module?
Start with the RMA intake form — our lab takes it from there.
Downloads & Support
Get the latest product documentation and support.