{"id":29,"date":"2026-09-18T04:27:14","date_gmt":"2026-09-18T12:27:14","guid":{"rendered":"https:\/\/www.gardarasemi.com\/?page_id=29"},"modified":"2026-09-20T03:57:20","modified_gmt":"2026-09-20T11:57:20","slug":"failure-analysis","status":"publish","type":"page","link":"https:\/\/www.gardarasemi.com\/zh\/support\/failure-analysis\/","title":{"rendered":"Failure Analysis"},"content":{"rendered":"
技术支持<\/div>

失效分析（FA）<\/h1>

Return a failed module and our lab will isolate the root cause \u2014 silicon, PCB, component or system level.<\/p><\/div><\/div>

失效分析流程<\/div>

从现象到根因<\/h2><\/div><\/div>
01<\/div>

RMA 受理<\/h4>

Submit S\/N, symptom and platform.<\/p><\/div>

02<\/div>

无损分析<\/h4>

电测、目检、X-Ray。<\/p><\/div>

03<\/div>

破坏性分析<\/h4>

开封、探针、材料分析。<\/p><\/div>

04<\/div>

8D 报告<\/h4>

根因 + 纠正措施。<\/p><\/div><\/div><\/div><\/div>

典型发现<\/div>

分析方向<\/h2>